Executive OverviewCertain inherent process characteristics such as precision, cleanliness, control and high productivity have been the hallmark of the entire implant industry for some time. Coupled with new capability, implant has become less of a commodity product and more enabling. In fact, the makers of the industry’s next-generation devices are looking to implant to improve established doping applications and facilitate new precision materials modification applications to provide device performance and yield improvements required for 22nm.James L. Kawski, Varian Semiconductor Equipment Associates, Gloucester, MA USARecently, implant has re-emerged as an enabler improving device performance and process variability that would otherwise unacceptably degrade as technology moves to 22nm.It is becoming more and more apparent that subsequent node transitions will expose new device performance and process limitations driven by scale and physics. Also, tool performance specifications … [Read more...] about Leveraging ion implant process characteristics to facilitate 22nm devices
Varian semiconductor equipment associates
BOBBY ISAACS and ANYA CORNELL, Texas Instruments, Dallas, Tex. Results can depend on the properties of the wafers used, the conditions of the implant, the conditions of the anneal process, and even the measurement technique.Semiconductor chip geometries continue to shrink, causing once unimportant parameters in the manufacturing process to become more critical. With the shrinkage in transistor size and requirements for improved precision in devices, ion implantation has become an increasingly more delicate and accurate operation. Implantation angle has become extremely important as transistors have decreased in size and voltage specifications. Adjustment and pocket implants, channeling implants, and high accuracy sidewall and HALO implants have become requirements for high performance, with little to no tolerance for incorrect implantation placement.FIGURE 1. Illustration of wafer slicing angle and associated offset.Older generations of ion implanters have been designed with only … [Read more...] about How to verify incident implant angles on medium current implants
By Mark LaPedus Applied Materials named Gary Dickerson, who has been serving as president of the company, as CEO. Mike Splinter, who held the reins since 2003, was elevated to executive chairman of the board. Dickerson served as the CEO of Varian, which Applied acquired in 2011, as well as the president and COO of KLA-Tencor.Applied Materials also announced its Q3 results. The company reported net income of $168 million for the quarter on $1.98 billion in net sales. Sequentially that is up slightly from Q2, but down year over year. Set against the backdrop of a slump in manufacturing equipment around the globe, which has been driven by weaknesses in Europe and Asia, this is relatively good news. “We are seeing stronger investment by our memory customers, and our display business booked its highest orders in over two years,” said Splinter in a statement.With little or no fanfare, NanoInk has filed for bankruptcy. Founded in 2001, the company pioneered so-called Dip Pen … [Read more...] about The Week In Review: Aug. 19
From today’s perspective, it seems clear that Gordon Moore got lucky. Back in 1965, Electronics magazine asked Moore-then research director of electronics pioneer Fairchild Semiconductor-to predict the future of the microchip industry. At the time, the industry was in its infancy; Intel, now the world’s biggest chip-maker, would not be founded (by Moore, among others) for another three years. Because few chips had been manufactured and sold, Moore had little data to go on. Nonetheless, he confidently argued that engineers would be able to cram an ever-increasing number of electronic devices onto microchips. Indeed, he guessed that the number would roughly double every year-an exponential increase that has come to be known as Moore’s Law. At first, few paid attention to Moore’s prediction. Moore himself admitted that he didn’t place much stock in it-he had been “just trying to get across the idea [that] this was a technology that had a … [Read more...] about The End of Moore’s Law?
Date: Thursday, April 30, 2015 at 1:00 p.m. ESTFree to attendLength: Approximately one hourToday the semiconductor industry is driven by smartphone with 1.24B units sold in 2014 out numbering tablets & PC sales. The expected increase in smartphone application processor (AP) demand in 2015 (Apple A9, Samsung Exynos 7 and Qualcomm Snapdragon) is driving the rapid ramp to 14/16nm 3-D FinFET at foundries, 3-D memory devices such as 128Gb Flash with 32-layers and 3-D stacked chips for package area saving. Intel was first to production with 3-D bulk-FinFET devices at the 22nm technology node in 2012 and reported their SOC for Chinese low-end smartphones. Intel’s 2nd generation bulk-FinFET devices at 14nm node was introduced in Aug 2014 and their SOC to follow. Apple uses Sony’s 8M pixel 3-D stacked backside CMOS image sensor for rear-facing cell phone camera and Samsung offers two versions of the 128Gb Flash memory either 16nm 2-D NAND or 32nm 3-D … [Read more...] about Trends in Materials: The Smartphone Driver
Date: December 15, 2016 at 1:00 p.m. ETFree to attendLength: Approximately one hourThe smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. Since 2011 the high end smartphone application processor (AP) has advanced a logic technology node every year using 45nm technology in 2011 for the Apple A5 AP in the iPhone 4s to the introduction of 14/16nm FinFET technology in 2015 for the iPhone 6s/6s+ A9 and also the Samsung Galaxy S6. This year (2016) the Galaxy S7 still uses 14nm FinFET and the iPhone 7/7+ A10 uses 16nm FinFET, but with the announcements from both Samsung and TSMC in Oct 2016 of their production start of 10nm FinFETs, smartphone APs using 10nm FinFET technology will appear in 2017 starting with the Samsung Galaxy S8 in March and then iPhone 7s … [Read more...] about Smartphone Market Driving 7nm & 5nm Node 3-D Transistors and Stacked Devices
By Jeff Dorsch, Contributing EditorThe used and refurbished semiconductor equipment market can be a hazardous business for buyers. The watchword always is: Caveat emptor – let the buyer beware.There are many reputable companies in the used equipment business, of course. Intel, Texas Instruments, and other big chipmakers put their surplus production equipment on the market, typically on an “as-is” basis.Some used-equipment vendors and brokers also offer their wares as they are, without any guarantees or warranties. The chip-making gear may be faulty; it could lack a software license from the original equipment manufacturer, which has occasionally been a legal issue.Many purveyors of used equipment are also involved in refurbishing pre-owned equipment, and some even develop their own equipment, given their experience in buying, maintaining, updating, and selling equipment.“It’s an interesting year. The industry has been very busy,” says Byron Exarcos, … [Read more...] about Buying used equipment? Be careful; know your seller